CW+ Premium Content/Computer Weekly
Thank you for joining!
Access your Pro+ Content below.
30 May 2023
The new shape of design in the age of Industry 4.0
This article is part of the Computer Weekly issue of 30 May 2023
With the advent of advanced comms technologies, interconnections are taking on an entirely new paradigm for engineering.
Access this CW+ Content for Free!
Already a member? Login here
Features in this issue
-
National semiconductor strategy: Balancing skills, migration and security
The UK government is putting £1bn into semiconductor research and design over the next 10 years to develop a robust chip sector
-
The new shape of design in the age of Industry 4.0
The modern manufacturing process has evolved over the last decades to the point where there are many interconnected disciplines taking place, often at the same time. With the advent of advanced comms technologies, interconnections are taking on a whole new paradigm for engineering.